Home Computer Components Cooling Xilence XPTP.X5 High Performance Thermal Paste, Spatula, 3g
Xilence XPTP.X5 High Performance Thermal Paste, Spatula, 3g

Xilence XPTP.X5 High Performance Thermal Paste, Spatula, 3g

Product Code: XZ019
Barcode 4044953501074

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Specification
Description
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Specification
assembly type: On CPU/Chip
colour: black
current catalog edition: 24.1
depth: 20 mm
depth of packaging (single piece): 110 mm
dimensions (hxwxd): 10 x 120 x 20 mm
gross weight: 0.034
height: 10 mm
height of packaging (single piece): 10 mm
manufacturer: XILENCE
noise level spinning (max.): 0 dB
package weight (single piece): 0.034 kg
processor socket: all
product group: Cooler/Fan
product type: Thermal Compound
scope of delivery: XPTP.X5 thermal compound, spatula
weight: 7 g
width: 120 mm
width of packaging (single piece): 190 mm
Description

High thermal conductivity and efficient cooling

The Xilence thermal paste has a high thermal conductivity and thus guarantees efficient cooling of the CPU. It works reliably at temperatures from -30 to +280°C.

  • Viscosity: 73 cps
  • Thermal conductivity: >5.15 W/m-K
  • Thermal resistance: <0.201°C in²/W
  • Dielectric constant A. >5.1
  • Operating temperature: -30 ~ +280°C
  • Spatula included

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