The Antec Nine Hundred was one of the most recognizable high-airflow cases of its time-known for its open design, aggressive cooling, and expandability that let builders push hardware harder than ever before. The new Antec 900 is a modern interpretation of that legacy.

• Edge AI & Workstation Ready: Supports ATX, E-ATX, SSI-CEB, SSI-EEB and AMD Threadripper.
• AI-Optimised GPU Support: Designed for multi-GPU/accelerator configurations, including AI-optimised GPUs such as NVIDIA RTX 6000 Ada, RTX A6000 and comparable compute cards.
• GPU and accelerator support: Designed for professional accelerator cards and full-length, three-slot GPUs used in AI, computing applications and 8K-capable gaming.
• Supports GPUs up to 495 mm in length and 160 mm in thickness: The spacious interior accommodates multi-accelerator layouts, blower computer cards, or mixed GPU and add-in card configurations.
• Storage & data availability: The total of 9 drive bays are a direct reference to the storage flexibility of the original, now redesigned for AI data sets, scratch disks, project libraries and RAID.
• Up to 9 drive bays: 5 x 2.5‘ and 4 x 3.5’ (or convertible for additional 2.5").

• Powerful airflow design: Features an ultra-enclosure design for excellent airflow and offers improved GPU cooling performance.
• Integrated fans for improved cooling performance: Equipped with 6 pre-installed high-performance fans, the 900 further optimises its airflow design to achieve more stable and superior overall cooling.
• 6 pre-installed high-performance fans with PWM control: 3 x TQ140 high-performance fans with a diameter of 140 mm for front intake, 2 x PI2R fans with a diameter of 120 mm and reverse flow on the power supply cover to stabilise the airflow in the chamber, 1 x TQ140 fan with a diameter of 140 mm for rear exhaust.
• Adjustable fan mount for different fan sizes: Supports 2 x 200 mm front fans for high airflow at low speeds in noise-sensitive environments.
• Multidirectional ventilation design
• Serious Cooling Headroom: Cooler mount: Up to 420 mm (<52 mm thick) at the front. Top up to 360 mm (<52 mm thickness).
• INNOVATIVE ISHIFT power supply 90° mount
• I/O panel: Equipped with a high-speed USB Type-C port with 10 Gbit/s.

• Supports back-connect motherboards: Plug in cables from the rear to keep the front clean and achieve more consistent airflow.
• 8 reusable PCIE slots: 8 expansion slots provide space for accelerators, capture cards, high-speed networking and storage controllers.
• Tool-free panel design: 4 mm thick tempered glass side panel, tool-free for quick access.
• Removable top cooling bracket: First attach the fans/coolers to the cooling bracket and then reattach the cooling bracket to the case.
• Complete dust filtration at the front, top and bottom
• Optimal cable routing