Cart
Your shopping cart is empty! 
Delock Thermal Conductive Pad 70 x 20 x 1.75 mm for M.2 modules 3.2 W/mK - Low Oil Bleeding
To purchase this product you must be registered in our system.
Specification
depth: 0.000
height: 0.000
width: 0.000
Description
| This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components. Low oil bleeding This pad releases very little oil, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with ‘low oil bleeding’ retain their thermal and mechanical properties better and thus ensure even and stable heat dissipation. Specification: • Thermal pad for heat dissipation • Low oil bleeding • Thermal conductivity: 3.2 W/mK • Operating temperature: -60 °C ~ 180 °C • Colour: grey • Dimensions (LxWxH): ca. 70 x 20 x 1.75 mm Package content: • 1 x thermal conductive pad Data sheet: http://www.delock.de/produkt/18467/pdf.html?sprache=en |
DCP SIA © 2025
Powered By:
