> >>Delock Thermal Conductive Pad 70 x 20 x 1.75 mm for M.2 modules 3.0 W/mK
New Delock Thermal Conductive Pad 70 x 20 x 1.75 mm for M.2 modules 3.0 W/mK

Delock Thermal Conductive Pad 70 x 20 x 1.75 mm for M.2 modules 3.0 W/mK

DELOCK

18474

New

This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.
Specification:
• Thermal pad for heat dissipation
• Thermal conductivity: 3.0 W/mK
• Operating temperature: -60 °C ~ 180 °C
• Colour: grey
• Dimensions (LxWxH): ca. 70 x 20 x 1.75 mm
Package content:
• 1 x thermal conductive pad
Data sheet:
http://www.delock.de/produkt/18474/pdf.html?sprache=en

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